2024 International Conference on Electronic Information Engineering and Image Processing

-Submission Portal- Mail Address: eieip@sub-paper.com If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
龚老师 | TEL:19980549041 (微信同号) | QQ:1841942468 | E-mail:eieip@sub-paper.com |
IMPORTANT DATES
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  • Submission Deadline 2024-11-28
  • Registration Deadline 2024-12-05
  • Conference Date 2024-12-12
  • Notification Date About a week after the submission
ORGANIZING COMMITTEES
Conference Committee Prof. Abid Yahya, Botswana International University of Science and Technology, Botswana Prof. Mir Sajjad Hussain Talpur, Institute of Information Technology, Sindh Agriculture University, Pakistan Prof. Prem Kumar Singh, Gandhi Institute of Technology and Management (deemed-to-be-university), India Prof. Kannan Hemachandran, Woxsen University, India Prof. Shahzad Ashraf, NFC Institute of Engineering and Technology, Pakistan Program Committee Dr. K.P.N Jayasena, Sabaragamuwa University of Sri Lanka, Sri Lanka Dr. Naruephorn Tengtrairat, Payap University, Thailand Dr. Koh You Beng, University of Malaya, Malaysia Dr. Eyad M. ALazam, Yarmouk University, Jordan Dr. Zeyneb Kurt, Northumbria University, UK Dr. V. Rossano, University of Bari, Italy Dr. Engr. Joe Marie Dormido, Carlos Hilado Memorial State University, Philippines Dr. Mingyan Xiao, California State Polytechnic University, USA International Technical Committee Dr. Paulo Batista, University of Aveiro, Portugal Prof. Georgios Theodoropoulos, Southern University of Science and Technology, UK Prof. D.Chimgee, National University of Mongolia, Mongolia Prof. Abdel-Badeeh M. Salem,  Ain Shams University, Egypt Prof. PHAKLEN EHKAN, University Malaysia Perlis, Malaysia Prof. Ahrar Husain, Jamia Millia Islamia, India Dr. Basant Subba, National Institute of Technology Hamirpur, India Dr. Dan Michael A. Cortez, Utah State University, The United States Dr. Raid Rafi Omar Al-Nima, Northern Technical University, Iraq Dr. Nikhil Tripathi, Technical University of Darmstadt, Germany Dr. Mohammed A. M. Abdullah, Ninevah University, Iraq Dr. Jing Yang, Universiti Malaya, Malaysia